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Universal Uncommitted Backplanes, 96 or 160 pin DIN
Available in slot counts of minimum 3 to 21 (0.80" spacing)
High performance wire-wrap interconnections
3U size can be combined into 6U or 9U
Accommodate 5-row, 160-pin DIN or 3 row, 96-pin DIN connectors
6 Layer construction
Layer 1 : Chassis Ground (component side)
Layer 2 : +5V
Layer 3 : AUX A (auxiliary voltage)
Layer 4: AUX B (auxiliary voltage)
Layer 5 : AUX C (auxiliary voltage)
Layer 6 : Circuit Ground (solder side)
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Interested in learning more about this product or need a custom solution? Please fill out the form below, and our team will get back to you promptly.
Universal (uncommitted) multilayer backplanes are designed for unique one of a kind applications requiring custom pin-out wiring from connector to connector. Each individual connector pin must be "assigned" by connecting to adjacent power or ground pins with wire or jumpers. Power or Ground input through a labeled series of power taps (screw terminals) along the top and bottom of the board.
These backplanes are designed for maximum utility by incorporating labeled rows of power and ground pins for each connector slot. Up to four distinct power planes and two ground planes accessible for each slot. +5V can be reassigned. Other power planes simply labeled AUX A, AUX B, and AUX C. Two separate ground planes available.
These backplanes are designed for maximum utility by incorporating labeled rows of power and ground pins for each connector slot. Up to four distinct power planes and two ground planes accessible for each slot. +5V can be reassigned. Other power planes simply labeled AUX A, AUX B, and AUX C. Two separate ground planes available.
Board specifications
- Material : 6 Layer FR-4 Epoxy Glass construction
- PCB UL94V-0, RoHS Compliant
- PCB Copper areas plated with Immersion Gold
Mechanical Specifications
- 3U Board Height = 5.067" (128.7mm)
- 3U size can be combined into 6U or 9U
- PCB thickness = 4.05mm
- Press-fit assembly
- Compatible with IEEE 1101.10 subracks
