• 44 Gold plated edge contacts (22 each side) on 0.156"(3.96mm) centers.
• Interleaved buses pattern on wiring side, solder coated for user convenience.
• Overall ground plane with clearance around each hole on component side.
• Mounts DIPs with 0.3”, 0.4” & 0.9” lead spacing.
• Unclad test point area at top of board.
• Row and column legends provided.