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• 44 Gold plated edge contacts (22 each side) on 0.156"(3.96mm) centers. • Interleaved buses pattern on wiring side only solder-coated for user convenience. • Bus outline silkscreened on component side to facilitate component placement. • Mounts DIPs with 0.3”, 0.4” & 0.9” lead spacing. • Unclad test point area at top of board • Row and column legends provided