• 44 Gold plated edge contacts (22 each side) on 0.156"(3.96mm) centers.
• Interleaved buses pattern on wiring side only solder-coated for user convenience.
• Bus outline silkscreened on component side to facilitate component placement.
• Mounts DIPs with 0.3”, 0.4” & 0.9” lead spacing.
• Unclad test point area at top of board
• Row and column legends provided