Pad-per hole pattern both sides. 0.062" diameter holes plated thru. 0.100" diameter isolated solder pad around each hole on both sides. 0.125" diameter corner mounting holes. Unrestricted component placement and extended area for high density applications..
Dimensions (H x W x Thick) | 2.00" x 3.00" x 0.062" (50.8mm x 76.2mm x 1.57mm) |
Hole Diameter | 0.062" (1.575mm) Not Plated Thru |
Grid | 0.156" x 0.156" (3.96mm x 3.96mm) |
Circuit Pattern | Pad per hole - both sides |
Material | FR4 |
UL Flammability Class | 94V-0 |
16 Pin DIP Capacity | N/A |
Wire-Wrap Terminals | - |
Solder Terminals | - |
Wire-Wrap Socket Pins | - |
Push-In Terminals | T28 |
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Ordering Info
Part Number : 8030
Specifications
Description