Pad-per hole pattern both sides. 0.062" diameter holes plated thru. 0.100" diameter isolated solder pad around each hole on both sides. ​0.125" diameter corner mounting holes. ​Unrestricted component placement and extended area for high density applications.​.

Dimensions

(H x W x Thick)

2.00" x 3.00" x 0.062"

(50.8mm x 76.2mm x 1.57mm)

Hole Diameter

0.062" (1.575mm) Not Plated Thru

Grid

0.156" x 0.156"

(3.96mm x 3.96mm)

Circuit Pattern

Pad per hole - both sides

Material
FR4
UL Flammability Class 94V-0
16 Pin DIP Capacity
N/A
Wire-Wrap Terminals
-
Solder Terminals-
Wire-Wrap Socket Pins
-
Push-In TerminalsT28


8030   Vectorbord® Circbord™

Downloads

Ordering Info


        Part Number : 8030

Specifications

Description