• Pad per hole & peripheral ground plane.
• 0.085” Square pads etched around each hole on wiring side.
• Accommodates any type DIP IC device or discrete component.
• Single sided board with pads and peripheral GND plane on one side only.
• Single-sided with no etch and plating on reverse side.
Description
Dimensions (H x W x Thick) | 4.50" x 6.50" x 0.062" (114.3mm x 165.1mm x 1.57mm) |
Hole Diameter | 0.042" (1.067mm) Not Plated Thru |
Grid | 0.100" x 0.100" square pads (2.54mm x 2.54mm) |
Circuit Pattern | Pad per hole, peripheral plane one side only |
Material | CEM-1 |
UL Flammability Class | 94V-0 |
16 Pin DIP Capacity | 60 |
Wire-Wrap Terminals | T44, T46, T49, T68 |
Solder Terminals | T42-1, K24C, K31C |
Wire-Wrap Socket Pins | R32 |
Downloads
Ordering Info
Part Number : 8003
Specifications