Description
• Interleaved buses pattern, ideal for wire-wrap applications.
• Power and ground buses etched onto wiring side only.
• Bus surfaces solder coated for user convenience.
• Mount components with 0.3”, 0.6” & 0.9” lead spacing.
• I/O area with square solder pads for connector mounting.
• Single-sided with no etch and plating on reverse side.
Specifications
Dimensions (H x W x Thick) | 4.50" x 6.50" x 0.062" (114.3mm x 165.1mm x 1.57mm) |
| Hole Diameter | 0.042" (1.067mm) Not Plated Thru |
| Grid | 0.100" x 0.100" (2.54mm x 2.54mm) |
| Circuit Pattern | Interleaved buses one side only |
| Material | CEM-1 |
| UL Flammability Class | 94V-0 |
| 16 Pin DIP Capacity | 20 |
| Wire-Wrap Terminals | T44, T46, T49, T68 |
| Solder Terminals | T42-1 |
| Wire-Wrap Socket Pins | R32 |
Ordering Info
Part Number : 8002
Downloads