Specifications
Description
Ordering Info
Part Number : 8001
Downloads
• 3-hole solder pad for interconnecting multiple component leads.
• I/O area with square solder pads for connectors mounting.
• Circuit pattern etched onto one side only.
• Single sided with no etch and plating on reverse side.
• Solder mount DIP sockets or IC devices with any lead spacing.
Dimensions (H x W x Thick) | 4.50" x 6.50" x 0.062" (114.3mm x 165.1mm x 1.57mm) |
Hole Diameter | 0.042" (1.067mm) Not Plated Thru |
Grid | 0.100" x 0.100" (2.54mm x 2.54mm) |
Circuit Pattern | 3-Hole pad one side only |
Material | CEM-1 |
UL Flammability Class | 94V-0 |
16 Pin DIP Capacity | 20 |
Wire-Wrap Terminals | T44, T46, T49, T68 |
Solder Terminals | T42-1, K24C, K31C |
Wire-Wrap Socket Pins | R32 |